compound vt. 1.使混合,调合,配合;【语言学】复合,合成。 2.(通过互相让步等)解决(纠纷);用钱了结(债务等);一次清算;部分偿还。 3.【电学】复绕[复激、复卷]。 compound a medicine 配药。 compound a felony 【法律】用钱抵赎罪罚。 vi. 和解,谈妥,和平了结。 compound with (sb.) 与(某人)和解[和平了结]。 adj. 混合的,复合的;合成的,复式的。 n. 混合物,合成品;【化学】化合物;【语言学】复合词。 cutting compound润削剂。 filling compound填料。 sealing compound封口胶。 compound2 n. 1.(印度等地工厂、住宅的)圈占地区(南非等地用围墙等围起的)矿工居住区。 2.圈有围墙[篱笆]等的场地〔临时战俘营收容所等〕;(同族聚居的)村寨。
5 . a formula is deduced to calculate the built - in voltage of the compound semiconductor 通过推导,得出一个计算化合物半导体异质结内建电势的公式。
Zinc oxide is a ii - vi wide band - gap ( 3 . 3ev ) compound semiconductor with wurtzite crystal structure 氧化锌( zno )是一种具有六方结构的?族宽带隙半导体材料,室温下带隙宽度高达3 . 3ev 。
Zinc oxide is a ii - iv wide band - gap ( 3 . 37ev ) compound semiconductor with wurtzite crystal structure 氧化锌( zno )是一种具有六方结构的的宽禁带-族半导体材料,室温下能带带隙eg为3 . 37ev 。
Zinc oxide is a ii - iv wide band - gap ( eg = 3 . 37ev ) compound semiconductor with wurtzite crystal structure 六角纤锌矿结构的氧化锌是一种重要的宽带隙-族半导体材料,室温下带隙为3 . 37ev 。
Plasma etching has been widely used in the etching process of si devices . now the study is focused on the microfabrication of compound semiconductor 等离子体干法刻蚀在硅器件的微细加工中已经得到广泛应用,目前研究的焦点集中在化合物半导体。
Research advances and applications of direct wafer bonding of - v compound semiconductors in optoelectronics device and its integration are generalized 概括介绍了近年来- v族化合物半导体材料键合技术的最新研究进展及其在光电子器件和集成领域的应用。
It is the only one compound semiconductor whose native oxide is sio2 . therefore , the sic devices can be manufactured using the technology of the silicon processing , for example mos devices Sic是唯一可以氧化生长成sio _ 2的化合物半导体材料,这使得它可以运用si平面工艺条件进行sic器件的制造,特别制作mos器件方面。
Led stands for light emitting diode , a kind of semiconductor which is used to give and receive the electronic signal into infrared rays or light , using the characteristics of compound semiconductor 半导体技术已经改变了世界,半导体照明技术将再一次改变我们的世界。随着半导体照明光源在城市景观商业大屏幕交通信号灯手机及